TECHNICAL SPECIFICATIONS

 

Main Technical Parameters

SDE-MJ Series

Grinding head   

22+2 Corner cut/Extra polish/Low-e film removing

Thickness of processing glass

3-25mm

Minimum glass width

450/300mm

Maximum glass width

4200/2500mm

Transmission speed

1-20m/min

Speed of size changing 8m/min
Grinding quantity of bottom 1-3mm
 Grinding quantity of chamfer  1-3mm

Table height

920±10mm

Total power

≈70kW

Voltage

380V/50Hz

 

 

 

Corner Cut
P
P
P
P
R
R
D
D
D
D

Distribution of Grinding Wheels(22+2 Coner Cut Device)

P
Device